Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Trade Fairs

The Research Association 3-D MID e.V plans to participate again at electronica in 2020

After its successful appearance at electronica trade fair in November 2018, the research association plans to participate again in the year 2020 with a joint booth at the electronica in Munich.

The world’s leading trade fair for components, systems and applications of electronics will take place from 10 to 13 November 2020 in Munich. In order to be able to reproduce the competencies over the entire production process again in the coming year, we again invite all our members to participate as co-exhibitors in the joint booth.

Picture 1: The image and video sequences for the production of molded interconnect devices attracted numerous interested parties to the MID joint booth

The open-concept booth concept of the Research Association 3-D MID e.V. was well received by exhibitors and visitors in 2017 and 2018 and will be used again in 2020. Transported by six technologically grouped monitors, the entire process chain for the production of molded interconnect devices was represented by means of image and video sequences. In addition, the potential of MID technology was illustrated by numerous exhibits from series production.

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