Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Computer Man Member area

Terminated Projects

The research association 3-D MID e.V. works on industry-related research topics.
The projects are financed from own funds (EFF) or within the scope of AiF projects with public funds of the BMWi (Federal Ministry of Economics and Technology).

Transcripts and results of the separate workgroups are provided for our members exclusively in the members area.


IGF Project 19605 N – AVerdi


IGF Project 19253 N – HF printing


IGF Project 19230 N – ActivePower


IGF Project 18374 N – Duroplast-LDS-MID



EFF-Project 3D Assembly – fixation in room


EFF-Project Duroplast-LDS-MID


EFF-Project Press-fit technology


EFF-Project Flip-Chip on MID


EFF-Project MID-QS-Directive


EFF-Project Reliability with MID


EFF-Project LDS-MID-Liability


EFF-Project Power carrying capacity


EFF-Project Thermal expansion behaviour


Development of a 3-D MID connector system


IGF-Project 12161 N – Determination of the chemical resistance of plastics


IGF-Project 16323 N – Automated assembly


IGF-Project 16737 N – LDS-MID-ChaMP


IGF-Project 16893 N – 3A-3D-MID


IGF-Project 17980 N – Roboter-based MID-Handling


IGF-Project 463 ZN – MID-Layout


IGF-Project 473 ZN – AFDiBa


IGF-Project 11454 N – Two-component injection moulding of MIDs


IGF-Project 11455 N – Spring-loaded conductive connection technology


IGF-Project 11612 N – Thermal application limits


IGF-Project 13187 N – ADDIMID


IGF-Project 14007 N – Radiation cross-linking of thermoplastics


IGF-Project 14035 N – Back feeding of thermoplastics


IGF-Project 14355 N – Connection technology of decentralized MID modules


IGF-Project 14739 N – FREE FORM


IGF-Project 15583 N – Solder resistance


IGF-Project 15684 N – PROMID


IGF-Project 16591 N – MID-Enclosure


IGF-Project 17179 N – HF-Features


IGF-Project 259 ZN – HT-MID




IGF-Project 326 ZN – HP-KSF


Conductive bonding on MID




Parameter development for market-driven 3D placement systems


Universal test piece


Trends in MID

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