Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Terminated Projects

The research association 3-D MID e.V. works on industry-related research topics.
The projects are financed from own funds (EFF) or within the scope of AiF projects with public funds of the BMWi (Federal Ministry of Economics and Technology).

Transcripts and results of the separate workgroups are provided for our members exclusively in the members area.

 

IGF Project 19605 N – AVerdi

 

IGF Project 19253 N – HF printing

 

IGF Project 19230 N – ActivePower

 

IGF Project 18374 N – Duroplast-LDS-MID

 

 

EFF-Project 3D Assembly – fixation in room

 

EFF-Project Duroplast-LDS-MID

 

EFF-Project Press-fit technology

 

EFF-Project Flip-Chip on MID

 

EFF-Project MID-QS-Directive

 

EFF-Project Reliability with MID

 

EFF-Project LDS-MID-Liability

 

EFF-Project Power carrying capacity

 

EFF-Project Thermal expansion behaviour

 

Development of a 3-D MID connector system

 

IGF-Project 12161 N – Determination of the chemical resistance of plastics

 

IGF-Project 16323 N – Automated assembly

 

IGF-Project 16737 N – LDS-MID-ChaMP

 

IGF-Project 16893 N – 3A-3D-MID

 

IGF-Project 17980 N – Roboter-based MID-Handling

 

IGF-Project 463 ZN – MID-Layout

 

IGF-Project 473 ZN – AFDiBa

 

IGF-Project 11454 N – Two-component injection moulding of MIDs

 

IGF-Project 11455 N – Spring-loaded conductive connection technology

 

IGF-Project 11612 N – Thermal application limits

 

IGF-Project 13187 N – ADDIMID

 

IGF-Project 14007 N – Radiation cross-linking of thermoplastics

 

IGF-Project 14035 N – Back feeding of thermoplastics

 

IGF-Project 14355 N – Connection technology of decentralized MID modules

 

IGF-Project 14739 N – FREE FORM

 

IGF-Project 15583 N – Solder resistance

 

IGF-Project 15684 N – PROMID

 

IGF-Project 16591 N – MID-Enclosure

 

IGF-Project 17179 N – HF-Features

 

IGF-Project 259 ZN – HT-MID

 

IGF-Project 303 ZBG – ZUMIKROSYS

 

IGF-Project 326 ZN – HP-KSF

 

Conductive bonding on MID

 

MIDCAD

 

Parameter development for market-driven 3D placement systems

 

Universal test piece

 

Trends in MID

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