MID manufacturers use various materials to which they have adapted their manufacturing processes. In essence, high-temperature and construction thermoplastics are provided with various surface coatings.
The most important material parameters to be considered are processing and service temperatures, flame retardancy, mechanical and electrical properties, sprayability and metallizability, and costs. The most common substrate materials are listed in the following table. The list makes no claim to completeness.
MIDs can be equipped with the surfaces used in conventional printed circuit board technology, e.g. tin/lead (Pb/Sn), gold (immersion or electroplated) or nickel.
