Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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MID-Materials and Surface Finishes

MID suppliers use various materials to which they have adapted their manufacturing processes. Basically, high temperature and engineering thermoplastics are furnished with various surface materials. The key material properties to be considered are processing and usage temperatures, required flammability rating, mechanical and electrical properties, mold and platability as well as cost. The following table comprises the most common substrate materials. The list does not claim to be complete.

MIDs can be equipped with the surfaces used in conventional printed circuit board technology, e.g. tin/lead (Pb/Sn), gold (immersion or electroplated) or nickel.


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