MID make the assembly between electronic, optic and mechanical elements and user defined shaped circuit carriers possible. They enable entirely new functions and support the miniaturization of electronic products. By eliminating mechanical components, the process chains will be shortened and the reliability is increased. The substrate materials are inherently flame retardant, easily to recycle and more ecologically. The novel design and functional possibilities offered by MID and the rationalisation potentials of the respective production methods inevitably lead to a quantum leap in electronics production.
The most important functions that can be integrated in MID are shown below. So far, cost savings up to 40 % have been achieved by integration, of course depending on the specific product, piece numbers and other boundary conditions.