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PRODID:-//Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V. - ECPv5.16.4//NONSGML v1.0//EN
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X-WR-CALNAME:Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
X-ORIGINAL-URL:https://www.3d-mid.de
X-WR-CALDESC:Events for Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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BEGIN:VTIMEZONE
TZID:Europe/Berlin
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20250330T010000
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DTSTART:20251026T010000
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20250701
DTEND;VALUE=DATE:20250702
DTSTAMP:20260428T172922
CREATED:20241210T170403Z
LAST-MODIFIED:20241210T170425Z
UID:23457-1751328000-1751414399@www.3d-mid.de
SUMMARY:2nd Board of Directors & Research Advisory Board Meeting
DESCRIPTION:[vc_row][vc_column width=”2/3″][vc_column_text]Do you have a groundbreaking and forward-looking idea for a research project in the field of Mechatronic Integrated Devices? \nThen we cordially invite you to present your project outline at our Research Advisory Board Meeting. \n  \nThe Research Association 3-D MID takes over all research topics for the functionalization of three-dimensional substrates in the Industrial Collective Research (IGF). In addition\, research into the additive production of integrated devices is also welcomed. Increasing focus is being placed on integrated production processes in order to be able to manufacture mechatronically integrated products directly in a system and thus obtain a highly functional miniaturized system. \n  \nPlease contact us by phone or e-mail\, see contact details. We look forward to your project idea! \n  \nInformation on Research at 3-D MID \nInformation on the IGF application procedure via the 3-D MID \nInformation about Membership at 3-D MID[/vc_column_text][/vc_column][vc_column width=”1/3″][vc_single_image image=”20217″ img_size=”full”][/vc_column][/vc_row]
URL:https://www.3d-mid.de/en/event/2nd-board-of-directors-research-advisory-board-meeting/
CATEGORIES:Meetings
ORGANIZER;CN="Research%20Association%203-D%20MID%20e.V.":MAILTO:info@3dmid.de
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20250702
DTEND;VALUE=DATE:20250704
DTSTAMP:20260428T172922
CREATED:20241123T095547Z
LAST-MODIFIED:20241202T170731Z
UID:23267-1751414400-1751587199@www.3d-mid.de
SUMMARY:16th Mechatronic Integration Discourse 2025
DESCRIPTION:[vc_row][vc_column width=”2/3″][vc_column_text]The International Mechatronic Integration Discourse is a scientific conference organized and carried out by the Research Association 3-D MID e.V. that deals with current topics on MID technologies. The Mechatronic Integration Discourse has established itself as an important meeting place for experts from industry and science and attracts around 200 participants who exchange views on the latest research results\, technological developments and practical applications. The congress language is English\, which enables international networking and a global exchange of experts. \nThe event includes a wide range of scientific lectures\, technical discussions and poster presentations in which current trends\, challenges and solutions in MID technologies are discussed. At the same time\, the congress offers space for personal encounters\, networking and the expansion of partnerships between science and business.[/vc_column_text]More information[vc_empty_space][/vc_column][vc_column width=”1/3″][vc_single_image image=”22195″ img_size=”full”][vc_column_text] \nPicture: Prof. Dr.-Ing. Jörg Franke opens the 15th Mechatronic Integration Discourse 2023\n[/vc_column_text][/vc_column][/vc_row]
URL:https://www.3d-mid.de/en/event/16th-mid-congress-2025/
LOCATION:ACC Amberger Congress Centrum\, Schießstätteweg 8\, Amberg\, 92224\, Deutschland
CATEGORIES:Conferences
ORGANIZER;CN="Research%20Association%203-D%20MID%20e.V.":MAILTO:info@3dmid.de
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