Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
+49 911 5302-9100
+49 911 5302-9102
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Congress MID

14th International Congress MID 2020

The research association 3-D MID e.V. invites again this year to the 14th International Congress MID 2020 from September 29th – 30th at the Amberger Congress Centrum (ACC). The approximately 150 participants from all over the world, who visited us in 2018, showed the existing great international interest in the 3-D MID technology. During the two days of the congress, numerous interesting lectures, divided into two tracks, will be held and listened to on all aspects of MID technology. The simultaneous industrial exhibition gives the participants the opportunity to inform themselves about the exhibiting companies during the breaks between the conference presentations and to have a lively exchange with other participants.

During the congress, the congress participants will have the opportunity to inform themselves about the respective companies at the stands and to establish contacts.

Other companies who would like to present themselves at the congress with a stand are welcome to contact the office directly. E-Mail to office

Diverse congress programme

After the motivating Opening Session, the MID Award will be presented for the 13th time this year on the occasion of the 14th International Congress Molded Interconnect Devices by the Research Association Spatial Electronic Devices 3-D MID e.V., as well as two awards for Best Paper in the categories Process and Application.

Picture 1: View of the Amberger Congress Center and St. Martin Church.
Source: www.acc-amberg.de

In 2018, the MID sponsorship prize was awarded to Dr.-Ing. Christoph Jürgenhake (Systematics for a prototype-based development of mechatronic systems in MID (Molded Interconnect Devices) technology.

The two Best Paper Awards were presented to:

Daniel Gräf, S. Neermann, L. Stuber, M. Scheets, J. Franke (Pushing the Boundaries of 3D-MID: Pulse-Width Modulated Light Technology for Enhancing Surface Properties and Enabling Printed Electronics on FFF-Printed Structures)

Dr. Jürgen Keck, D. Juric, K. Gläser, A. Zimmermann, W. Eberhardt, B. Freisinger, M. Völker (Low-Temperature Sintering of Nanomental Inks on Polymer Substrates)

With these awards, the Research Association honors scientific work that sets special accents for the technological development of mechatronically integrated assemblies.

This will be followed by further exciting presentations and participants will be able to choose between the presentations from two tracks during the course of the first day. The first day of the congress will then end pleasantly with a regional dinner. This opportunity provides the perfect setting for networking and exchange with the other participants.

The second day also offers a wide range of highly relevant lectures. After the closing words, a technical tour will be offered, which will give the participants interesting insights into new innovations.

Contact

Fürther Strasse 246b
D-90429 Nürnberg
Phone: +49 911 5302-9100
Fax: +49 911 5302-9102
E-Mail: info@3dmid.de

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