NEWS IN BRIEF

  • Become a member in the largest global network for MID technology and benefit from exclusive advantages.

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  • MID-Industry-Award 2017 - Award ceremony at the the productronica 2017 trade fair. Submit Your application now!

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  • The standard reference work for 3-D MID offers a comprehensive overview of the latest state of technology on 350 pages.

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Molded Interconnect Devices

The use of high temperature thermoplastics and their structured metallization opens up a new dimension of circuit carrier design to the electronic industry: Molded Interconnect Devices (MID). MID are injected molded thermoplastic parts with integrated circuit traces. They provide enormous technical and economic potential and offer ... read more
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3-D MID e.V. and AIF