NEWS IN BRIEF

  • Become a member in the largest global network for MID technology and benefit from exclusive advantages.

    Further information

  • 12. international congress MID: Enlarged potentials by printed electronics and additive manufacturing processes.

    Further information

  • The standard reference work for 3-D MID offers a comprehensive overview of the latest state of technology on 350 pages.

    Further information

Molded Interconnect Devices

The use of high temperature thermoplastics and their structured metallization opens up a new dimension of circuit carrier design to the electronic industry: Molded Interconnect Devices (MID). MID are injected molded thermoplastic parts with integrated circuit traces. They provide enormous technical and economic potential and offer ... read more
News
3-D MID e.V. Membership?
Research
Publications
Contact us
3-D MID e.V. and AIF