3-D MID e.V. Forschungsvereinigung Räumliche Elektronische Baugruppen

More than 90 cooporations and research institutes are members of the Research Association for Molded Interconnect Devices e. V.

The membership in the Research Association is voluntary and possible for all Cooperations, research institutes and universities. You can find the application for the membership here . The board of directors of the Research Association 3-D MID e. V. decides about the final acceptance of the membership application.

Exclusive for our members

Participation in topic oriented workshops
Participation in project accompanying boards of research projects
Participation in other work groups
Publication of company logo and contact person at the MID-Homepage
Participation at the joint stand at the SMT Hybrid Packaging
Access to the intranet of the Research Association with current research results and a large literature collection
Reduced admission charges at the MID Congress and other MID-events
Low-priced purchase of publications from the Research Association 3-D MID e. V.
Monthly an example of the business magazine PLUS with current MID-Information free of charge
MID-Newsletter with current information about MID-Technology

For further information please contact the executive board . List of our members .

... Download Application for Membership (pdf)

... Download Statute (pdf)

... Download Imagebroschüre (pdf) (German Version)

Forschungsvereinigung
Räumliche Elektronische
Baugruppen 3-D MID e.V.
Fürther Strasse 246b
D-90429 Nürnberg
Telefon:	+49 911 5302-9100
Fax:	+49 911 5302-9102
E-Mail:	Membership More than 90 cooporations and research institutes are members of the Research Association for Molded Interconnect Devices e. V. The membership in the Research Association is voluntary and possible for all Cooperations, research institutes and universities. You can find the application for the membership here . The board of directors of the Research Association 3-D MID e. V. decides about the final acceptance of the membership application. Exclusive for our members Participation in topic oriented workshops Participation in project accompanying boards of research projects Participation in other work groups Publication of company logo and contact person at the MID-Homepage Participation at the joint stand at the SMT Hybrid Packaging Access to the intranet of the Research Association with current research results and a large literature collection Reduced admission charges at the MID Congress and other MID-events Low-priced purchase of publications from the Research Association 3-D MID e. V. Monthly an example of the business magazine PLUS with current MID-Information free of charge MID-Newsletter with current information about MID-Technology For further information please contact the executive board . List of our members . ... Download Application for Membership (pdf) ... Download Statute (pdf) ... Download Imagebroschüre (pdf) (German Version) top ©2008 Research Association Molded Interconnect Devices 3-D MID e.V.