More than 90 cooporations and research institutes are members of the Research Association for Molded Interconnect Devices e. V.
The membership in the Research Association is voluntary and possible for all Cooperations, research institutes and universities. You can find the application for the membership here . The board of directors of the Research Association 3-D MID e. V. decides about the final acceptance of the membership application.
Exclusive for our members
- Participation in topic oriented workshops
- Participation in project accompanying boards of research projects
- Participation in other work groups
- Publication of company logo and contact person at the MID-Homepage
- Participation at the joint stand at the SMT Hybrid Packaging
- Access to the intranet of the Research Association with current research results and a large literature collection
- Reduced admission charges at the MID Congress and other MID-events
- Low-priced purchase of publications from the Research Association 3-D MID e. V.
- Monthly an example of the business magazine PLUS with current MID-Information free of charge
- MID-Newsletter with current information about MID-Technology