Molded Interconnect Devices

The use of high temperature thermoplastics and their structured metallization opens up a new dimension of circuit carrier design to the electronic industry: Molded Interconnect Devices (MID). MID are injected molded thermoplastic parts with integrated circuit traces. They provide enormous technical and economic potential and offer ... read more

9th MID-Congress

Information about

the accompanying

industrial exhibition

you will find at the

congress-sites

3-D MID e.V. Membership?

The membership in the Research Association is voluntary and possible for all Cooperations, research institutes and universities

Membership

Research

The Research Association Molded Interconnect Devices is working in research fields in close cooperation with the industry

Research

Publications

Publications of the research group 3-D MID e.V. and of our members you can find here.

Contact us

Research Association

Molded Interconnect

Devices 3-D MID e.V.
Phone: +49.911.580 58 17
Fax: +49.911.580 58 30

3-D MID e.V. and AIF

Member of the German Federation of Industrial Research Associations